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- Clarkdale – 32 nm process technology
- 2 physical cores/2 threads
- 3 MB L3 cache
- Introduced January 2010
- Socket 1156 LGA
- 2-channels DDR3
- Integrated HD GPU
- Variants
- G6950 - 2.8 GHz (No HyperThreading)
- Clarkdale – 32 nm process technology
- 2 physical cores/4 threads
- 64 Kb L1 cache
- 512 Kb L2 cache
- 4 MB L3 cache
- Introduced January, 2010
- Socket 1156 LGA
- 2-channels DDR3
- Integrated HD GPU
- Variants
- 530 – 2.93 GHz Hyper-Threading
- 540 – 3.06 GHz Hyper-Threading
- 550 – 3.2 GHz Hyper-Threading
- 560 – 3.33 GHz Hyper-Threading
- Lynnfield – 45 nm process technology
- 4 physical cores
- 32+32 Kb (per core) L1 cache
- 256 Kb (per core) L2 cache
- 8 MB common L3 cache
- Introduced September 8, 2009
- Family 6 Model E (Ext. Model 1E)
- Socket 1156 LGA
- 2-channels DDR3
- Variants
- 750S – 2.40 GHz/3.20 GHz Turbo Boost
- 750 – 2.66 GHz/3.20 GHz Turbo Boost
- 760 – 2.80 GHz/3.33 GHz Turbo Boost
- Clarkdale – 32 nm process technology
- 2 physical cores/4 threads
- 64 Kb L1 cache
- 512 Kb L2 cache
- 4 MB L3 cache
- Introduced January, 2010
- Socket 1156 LGA
- 2-channels DDR3
- Integrated HD GPU
- AES Support
- Variants
- 650/655K – 3.2 GHz Hyper-Threading Turbo Boost
- 660/661 – 3.33 GHz Hyper-Threading Turbo Boost
- 670 – 3.46 GHz Hyper-Threading Turbo Boost
- 680 – 3.60 GHz Hyper-Threading Turbo Boost
- Bloomfield – 45 nm process technology
- 4 physical cores
- 256 KB L2 cache
- 8 MB L3 cache
- Front side bus replaced with QuickPath up to 6.4GT/s
- Hyper-Threading is again included. This had previously been removed at the introduction of Core line
- 781 million transistors
- Intel Turbo Boost Technology
- TDP 130W
- Introduced November 17, 2008
- Socket 1366 LGA
- 3-channels DDR3
- Variants
- 975 (extreme edition) – 3.33 GHz/3.60 GHz Turbo Boost
- 965 (extreme edition) – 3.20 GHz/3.46 GHz Turbo Boost
- 960 - 3.20 GHz/3.46 GHz Turbo Boost
- 950 – 3.06 GHz/3.33 GHz Turbo Boost
- 940 – 2.93 GHz/3.20 GHz Turbo Boost
- 930 – 2.80 GHz/3.06 GHz Turbo Boost
- 920 – 2.66 GHz/2.93 GHz Turbo Boost
- Lynnfield – 45 nm process technology
- 4 physical cores
- 256 KB L2 cache
- 8 MB L3 cache
- No QuickPath, instead compatible with slower DMI interface
- Hyper-Threading is included
- Introduced September 8, 2009
- Socket 1156 LGA
- 2-channels DDR3
- Variants
- 880 – 3.06 GHz/3.73 GHz Turbo Boost (TDP 95W)
- 870/875K – 2.93 GHz/3.60 GHz Turbo Boost (TDP 95W)
- 870S – 2.67 GHz/3.46 GHz Turbo Boost (TDP 82W)
- 860 – 2.80 GHz/3.46 GHz Turbo Boost (TDP 95W)
- 860S – 2.53 GHz/3.46 GHz Turbo Boost (TDP 82W)
Westmere
- Gulftown – 32 nm process technology
- 6 physical cores
- 256 KB L2 cache
- 12 MB L3 cache
- Front side bus replaced with QuickPath up to 6.4GT/s
- Hyper-Threading is included
- Intel Turbo Boost Technology
- Socket 1366 LGA
- TDP 130W
- Introduced 16 March 2010
- Variants
- 980X Extreme Edition - 3.33 GHz/3.60 GHz Turbo Boost
- 970 - 3.20 GHz/3.46 GHz Turbo Boost
- Intel Core i7 Mobile Processor Family – 45 nm process technology
- 4 physical cores
- Hyper-Threading is included
- Intel Turbo Boost Technology
- Variants
- 940XM Extreme Edition - 2.13 GHz/3.33 GHz Turbo Boost (8 MB L3, TDP 55W)
- 920XM Extreme Edition - 2.00 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 55W)
- 840QM - 1.86 GHz/3.20 GHz Turbo Boost (8 MB L3, TDP 45W)
- 820QM - 1.73 GHz/3.06 GHz Turbo Boost (8 MB L3, TDP 45W)
- 740QM - 1.73 GHz/2.93 GHz Turbo Boost (6 MB L3, TDP 45W)
- 720QM - 1.60 GHz/2.80 GHz Turbo Boost (6 MB L3, TDP 45W)
- Gainestown – 45 nm process technology
- Same processor dies as Bloomfield
- 256 KB L2 cache
- 8 MB L3 cache, 4MB may be disabled
- QuickPath up to 6.4GT/s
- Hyper-Threading is included in some models
- 781 million transistors
- Introduced March 29, 2009
- Variants
- W5590, W5580, X5570, X5560, X5550, E5540, E5530, L5530, E5520, L5520, L5518 – 4 Cores, 8 MB L3 cache, HT
- E5506, L5506, E5504 – 4 cores, 4 MB L3 cache, no HT
- L5508, E5502, E5502 – 2 cores, 4 MB L3 cache, no HT
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